My podcast guest this week is Jan Zimmerman from TEWS Technologies. Jan and I are talking all about VITA 93 – a new QMC mezzanine card standard and why scalability, modularity and flexibility are central elements of this new standard. Jan and I also discuss the unique I/O capabilities of QMCs and how TEW Technologies is furthering innovation in this arena.
… Read More → "Scalability, Modularity, Flexibility with QMCs and VITA 93"
“Good grief, Charlie Brown!” I just exclaimed upon realizing that I’ve hit another 100-column milestone (including this one) here on EE Journal. That makes 400 columns since I joined the community.
As my columns average around 1,500 words apiece, that’s a whopping 600,000 words—each one handpicked at the crack of dawn whilst still glistening with the morning dew, fresh, fragrant, and … Read More → "WTW (“What the What”)? Another 100 Mindboggling Columns!"
I’m a weak-willed man. I was fully intending to write this column on the topic of simulating radio frequency (RF) designs and devices, including communications and radar systems, when… SQUIRREL!!!
To set the scene and ensure we’re all tap-dancing to the same skirl of the bagpipes—as I previously mentioned in my Read More → "Remarkable Rotary Dial Delights"
My podcast this week is Eric Biel from Powercast. Eric and I explore each of Powercast’s innovative wireless power solutions, the origins of their Lifetime power solution, the benefits of their next generation RFID tags, and super cool new applications they unveiled at the 2025 Consumer Electronics Show.
… Read More → "No batteries? No problem! Powercast and The Freedom of Wireless Power"
My mission today is to inform you about a university course that is no longer offered and a master’s degree program that is not yet available. Intrigued? Read on…
To set the scene, first let me remind you that I originally hail from England. I started at Sheffield Polytechnic (now Sheffield Hallam University) in the summer of 1975. You can read more about … Read More → "Teaching AI to Semiconductor Students, Engineers, and Fabs"
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