Tabula Taps Intel
22nm Tri-Gate Process Should Bring Rewards
We all knew it was coming, but Tabula “officially” announced this week that they are producing their next yet-to-be-announced family of FPGAs on Intel’s 22nm Tri-Gate process. As one of the worst-kept secrets in the programmable logic industry, the Intel-Tabula relationship hardly comes as a surprise. The announcement was widely leaked about a year ago when Achronix formally announced a similar relationship with Intel.
What does it all mean? Read More
latest news
February 22, 2012
Cadence to Showcase Advanced Verification at DVCon 2012
February 21, 2012
Integrating models and code with new Visual Studio extension
Cortus announces Processor IP Roadmap for Embedded System on Chip (SoC) Applications
February 17, 2012
LDRA Opens Division Dedicated to Comprehensive Certification Services
Agilent Technologies Introduces Industry’s Most Comprehensive LPDDR3 Compliance Test Application
Imec and Holst Centre present 14 key achievements at International Solid-State Circuits Conference
Magma Enables ZiiLABS to Double the Performance, Cut Power by Half on 100-Core ZMS-40 Processor
February 16, 2012
Avnet Electronics Marketing Americas Adds MEMS Oscillators from Discera to Line Card
Real Intent Improves Lint Coverage and Usability
February 15, 2012
February 14, 2012
Synopsys Announces Industry's First HDMI 1.4 PHY IP in 28-nanometer Processes for Multiple Foundries
February 13, 2012
Imec announces world-first 300mm-fab compatible directed self-assembly process line
Real-World Issues at 28nm
Cadence and Samsung Do Some Pipe Cleaning
They Want Your Brains
EDA is Not Quite Dead After All
DesignCon Take 2
Floating Point for FPGAs and TI’s Signal Integrity Solutions
A New Crop of Wafer Inspection Tools
KLA-Tencor Announces Upgrades All Around
The PC In Your Ear
Intel’s Medfield to Debut in Smartphones; Microsoft Plays Both Sides
Editors' Blog
Missing LED Details
posted by Bryon Moyer
Two releases promise to take LED pricing where it hasn’t gone before. There is just one thing missing. (10-Feb)
A Diving Board, Water Drop, and Flashlight
posted by Bryon Moyer
It almost sounds like a summer camp project: make a switch out of a diving board, a drop of water, and a flashlight. Ready? Go! The only problem: we’re talking micro dimensions. (3-Feb)
Engineering GaN Wafers
posted by Bryon Moyer
How can you make an expensive wafer go further? (2-Feb)
From Conductor to Insulator
posted by Bryon Moyer
How do you turn metal into ceramic? So to speak…? (1-Feb)
Establishing 3D IC Standards – Or Not
posted by Bryon Moyer
An upcoming DesignCon panel will debate what does and does not need to be standardized in the 3D IC world. (26-Jan)
Semiconductor Editors' Blog Archive
forum
subscribe to our semiconductor/ic newsletter
On Demand
A Platform for Reducing Verification Time and Improving Reliability of Embedded System Hardware
White Paper sponsored by Kozio
Maximize Design Productivity With PCIe/104 FPGA/Processor
Chalk Talk sponsored by Kontron
Integrated Power and System Management
Chalk Talk sponsored by Lattice
Optimizing 10-Gbps Backplane Performance on Stratix V FPGAs
IP and Process Solutions for Energy-efficient PMICs
Chalk Talk sponsored by ARM
Using External Memory Interfaces to Achieve Efficient High-Speed Memory Solutions
White Paper sponsored by Altera
Hierarchical Design Flows: Design Preservation & Team Design
Chalk Talk sponsored by Xilinx
Understanding the Impact of Single Event Effects in Avionics Applications
White Paper sponsored by Microsemi
Leveraging OCP for Cache Coherent Traffic Within an Embedded Multi-core Cluster
White Paper sponsored by MIPS
Optimizing Performance, Power, and Area in SoC Designs Using MIPS® Multi-threaded Processors
White Paper sponsored by MIPS
Semiconductor On Demand Archive