Intersil Re-emerges

posted by Bryon Moyer

Intersil is reintroducing itself as it aims its power technology squarely at two new markets. (22-Apr)

On the Scene: Project Ara

posted by Amelia Dalton

The race hasn't yet begun. In fact, we're not even on the starting block, but the rule book for this race - the race to the next major innovative mobile platform (smartphone) has been drafted and teams are starting to assemble. Google's Project Ara, the world's first completely modular smartphone is coming, and the modules will be designed by... YOU! On your mark. Get set. Design! (21-Apr)

Wireless and LED Power Combined

posted by Bryon Moyer

Daintree and LG have collaborated to integrate Zigbee into LED drivers for commercial lighting. (17-Apr)

New SEMulator 3D Announced

posted by Bryon Moyer

Coventor has released its next edition of their semiconductor process modeling tool. (16-Apr)

Free Markets and IoT Conferences

posted by Bryon Moyer

"IoT" is a buzzword, no doubt. But you could spend a lot of time in IoT conferences. How would you choose? (15-Apr)

On the Scene: Element14 Tour of Boards

posted by Amelia Dalton

Three little letters that rule the world. They are but the sun and we are but the moon. Oh IoT, where would we be without you? 2012 perhaps? In this episode of “On The Scene” we examine a wide range of IoT small-form-factor boards with Cliff Ortmeyer of Element14. Join us while we tour Element14’s booth at this year’s EELive! expo, and get chatty with Cliff. (11-Apr)

Spintronics recognition

posted by Dick Selwood

(11-Apr)

IC Compiler Reinvented

posted by Bryon Moyer

Synopsys has redone its flagship IC implementation tools from the ground up. (10-Apr)

On the Scene: EELive 2014 Wrap Up

posted by Amelia Dalton

We stormed the gates. We took no prisoners. But, we did take home a lot of pens. Most importantly, we learned some stuff. Welcome to my new video blog called “On the Scene.” You can expect some jokes. You can expect some insight about this year’s Embedded Systems Conference (or whatever they’re calling it this week). And you can expect to see my smiling face. Think of it like a funny tech snack - if you will. (10-Apr)

Moving Back to Software

posted by Bryon Moyer

TI’s new substation collaboration allows a software solution to replace hardware – the reverse of what typically happens as a market matures. What’s up with that? (9-Apr)

Metal Oxide Photoresists Lower Roughness

posted by Bryon Moyer

Narrower lines mean less tolerance for roughness along the edges. Inpria says that means it’s time for a new kind of resist. (8-Apr)

A Jump in EUV Resist Sensitivity?

posted by Bryon Moyer

An Osaka University experiment suggests that a two-step exposure – masked and then flooded – can boost sensitivity. (3-Apr)

More MEMS Microphone Options

posted by Bryon Moyer

Akustica announced new HD microphones, with size and porting options for more design flexibility. (2-Apr)

EUV Blasts through 100 W

posted by Bryon Moyer

In a surprise to everyone except the guys working on the project, the latest EUV upgrade took the power far beyond expectations. (1-Apr)

Cleaning Up the Verification Shop

posted by Bryon Moyer

You know how it is: you go buy this company and set it over here, and then you buy that company and you find room for it over there, and, well, eventually the room is a mess. Time to clean up. (27-Mar)

Power Editors' Blog Archive

subscribe to our power newsletter


Login Required

In order to view this resource, you must log in to our site. Please sign in now.

If you don't already have an acount with us, registering is free and quick. Register now.

Sign In    Register