July 15, 2014

TI introduces its latest RF430 security MCU with highest RF integration in the industry; new evaluation module jumpstarts designs

July 14, 2014

Fairview Microwave Announces New Lines of RF Rotary Joints

New THIN Mini-ITX Barebone System with 4th Generation Intel® Core i5/Celeron for Medical, Gaming, Digital Signage Applications

Zero-Drift Instrumentation Amplifier From Microchip Provides Low Power and High Accuracy With Self-Correcting Architecture

Intersil Introduces New Voltage Options for Radiation Hardened Family of Ultra Low Noise, High Precision Voltage References

July 11, 2014

memsstar Launches Next-Generation MEMS Etch and Deposition Equipment

CyberOptics® Features the New ReticleSense Airborne Particle Sensor and Announces Extension of its APS line to 150mm at SEMICON West 2014

July 10, 2014

Applied Materials Introduces CVD and CMP Systems for 3D Architectures

Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

Agilent Technologies Introduces Industry’s Most Accurate Test Solution for USB 3.1 Receivers

VadaTech Announces Line of FMCs for Network Interface

4th International Workshop on Power Supply on Chip (PowerSoC2014) to be held at Northeastern University Boston MA on October 6-8, 2014.

July 09, 2014

Calling all tech start-ups to enter – Discovering Start-Ups 2014 Competition

Indium Corporation Announces RMA-155 Pb-Free Solder Paste

July 08, 2014

KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies

Synopsys Expands Verification IP Portfolio with Compliance Test Suites

ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution

Mentor Graphics Expands Automotive Portfolio, Acquires XS Embedded to Reduce Time to Start of Production (SOP)

Imec and its Partners Achieve Record Efficiency for Large Area Industrial Crystalline-silicon n-PERT Solar Cell

5A, 15V 2-Phase Synchronous Boost Regulator Offers 95% Efficiency, 3MHz Switching & Output Disconnect in a 3mm x 5mm DFN

Synopsys Cuts Area of DesignWare NVM IP for Automotive Grade 0 Applications by 75 Percent

InvenSense To Acquire Movea, A Leading Provider Of Ultra-Low Power Motion And Data Fusion Software Platforms And Trusted Positioning, Inc., A Leader In Indoor/Outdoor Location Technology

July 07, 2014

Avago Technologies Introduces New Series of Reflective Optical Encoders for Low Power Miniaturized Motion Control Systems

Hitachi Tapes Out 28nm Design with Cadence Tempus Timing Signoff Solution, Reducing Timing Closure by One Month

Digitizer Cards Get FPGA-Based Signal Averaging Capabilities


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