July 21, 2014

Altera Joins the Embedded Vision Alliance

Vector Software Announces Support for MISRA C: 2012

July 17, 2014

Agilent Technologies Hosts 5G Test Summit at FuTURE MOBILE COMMUNICATION FORUM

Nutaq Announces Launch of MO1000 an 8/16 Channel, 1000MSPS, 16 bits, Phased Aligned D/A FMC

Cadence Announces Protium Rapid Prototyping Platform and Expands System Development Suite Low-Power Verification

July 16, 2014

Standex-Meder Electronics Electronics Announces MK15-501 Reed Sensors for SMD Mounting

VadaTech Announces Express Development Platforms

Microsemi Continues its Leadership in Timing Solutions by Unveiling Ultra-low Jitter and Ultra Small Size Clock Management Devices

Mentor Graphics Launches Comprehensive Solution for Heterogeneous Multicore Embedded Software Development

July 15, 2014

Microchip Extends Spotify® Connect Support in New JukeBlox® Platform Release

Emulex Accelerates Verification Closure with Synopsys Verification IP for Ethernet

Renesas Electronics Intellectual Property for Capacitive Touch Sensing Delivers Industry-Leading Performance for Human Machine Interface Applications

Cadence Announces Next-Generation Quantus QRC Extraction Solution, Delivering Best-in-Class Performance and Accuracy

CommAgility’s new AMC provides high-performance Virtex-7 FPGA

Cadence Quantus QRC Extraction Solution Certified for TSMC 16nm FinFET

Lattice’s New iCE40 Ultra Family Speeds Customization of ‘Killer’ Features for Mobile Devices

TI introduces its latest RF430 security MCU with highest RF integration in the industry; new evaluation module jumpstarts designs

July 14, 2014

Fairview Microwave Announces New Lines of RF Rotary Joints

New THIN Mini-ITX Barebone System with 4th Generation Intel® Core i5/Celeron for Medical, Gaming, Digital Signage Applications

Zero-Drift Instrumentation Amplifier From Microchip Provides Low Power and High Accuracy With Self-Correcting Architecture

Intersil Introduces New Voltage Options for Radiation Hardened Family of Ultra Low Noise, High Precision Voltage References

July 11, 2014

memsstar Launches Next-Generation MEMS Etch and Deposition Equipment

CyberOptics® Features the New ReticleSense Airborne Particle Sensor and Announces Extension of its APS line to 150mm at SEMICON West 2014

July 10, 2014

Applied Materials Introduces CVD and CMP Systems for 3D Architectures

Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit


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